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M27C801
8 Mbit (1Mb x8) UV EPROM and OTP EPROM
5V 10% SUPPLY VOLTAGE in READ OPERATION FAST ACCESS TIME: 45ns LOW POWER CONSUMPTION: - Active Current 35mA at 5MHz - Standby Current 100A PROGRAMMING VOLTAGE: 12.75V 0.25V PROGRAMMING TIME: 100s/byte (typical) ELECTRONIC SIGNATURE - Manufacturer Code: 20h - Device Code: 42h
32
32
1
1
FDIP32W (F)
PDIP32 (B)
DESCRIPTION The M27C801 is an 8 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for applications where fast turn-around and pattern experimentation are important requirements and is organized as 1,048,576 by 8 bits. The FDIP32W (window ceramic frit-seal package) hastransparentlid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C801 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
PLCC32 (K)
TSOP32 (N) 8 x 20mm
Figure 1. Logic Diagram
VCC
20 A0-A19
8 Q0-Q7
E
M27C801
Table 1. Signal Names
A0-A19 Q0-Q7 E GVPP VCC VSS Address Inputs Data Outputs Chip Enable Output Enable / Program Supply Supply Voltage Ground
GVPP
VSS
AI01267
September 1998
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M27C801
Figure 2A. DIP Pin Connections
A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27C801 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17
AI01268
Figure 2B. PLCC Pin Connections
VCC A18 A17 A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3
A7 A6 A5 A4 A3 A2 A1 A0 Q0
A12 A15 A16 A19 VCC A18 A17 1 32 A14 A13 A8 A9 A11 GVPP A10 E Q7 9 M27C801 25 17 Q1 Q2 VSS Q3 Q4 Q5 Q6
AI01814
Figure 2C. TSOP Pin Connections
A11 A9 A8 A13 A14 A17 A18 VCC A19 A16 A15 A12 A7 A6 A5 A4 1 32 GVPP A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 A3
8 9
M27C801 (Normal)
25 24
Read Mode The M27C801 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equalto the delay from E to output (tELQV). Data is availableat the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least t AVQV-tGLQV. Standby Mode The M27C801 has a standby mode which reduces the supply current from 35mA to 100A The M27C801 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standbymode, the outputs are in a high impedance state, independent of the GVPP input. Two Line Output Control BecauseEPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: a. the lowest possible memory power dissipation, b. complete assurance that output bus contention will not occur.
16
17
AI01269
DEVICE OPERATION The operating modes of the M27C801 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for GVPP and 12V on A9 for Electronic Signature and Margin Mode Set or Reset.
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M27C801
Table 2. Absolute Maximum Ratings (1)
Symbol TA TBIAS TSTG VIO
(2)
Parameter Ambient Operating Temperature Temperature Under Bias Storage Temperature Input or Output Voltages (except A9) Supply Voltage A9 Voltage Program Supply Voltage
(3)
Value -40 to 125 -50 to 125 -65 to 150 -2 to 7 -2 to 7 -2 to 13.5 -2 to 14
Unit C C C V V V V
VCC VA9
(2)
VPP
Notes: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not i mplied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2. Minimum DC voltage on Input or Output is -0.5V with possible undershoot to -2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 3. Depends on range.
Table 3. Operating Modes
Mode Read Output Disable Program Program Inhibit Standby Electronic Signature
Note: X = VIH or VIL, VID = 12V 0.5V.
E VIL VIL VIL Pulse VIH VIH VIL
GVPP VIL VIH VPP VPP X VIL
A9 X X X X X VID
Q0 - Q7 Data Out Hi-Z Data In Hi-Z Hi-Z Codes
Table 4. Electronic Signature
Identifier Manufacturer's Code Device Code A0 VIL VIH Q7 0 0 Q6 0 1 Q5 1 0 Q4 0 0 Q3 0 0 Q2 0 0 Q1 0 1 Q0 0 0 Hex Data 20h 42h
For the most efficient use of thesetwo control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
System Considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitiveand inductive loading of the deviceat the output.
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M27C801
Table 5. AC Measurement Conditions
High Speed Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages 10ns 0 to 3V 1.5V Standard 20ns (10% to 90%) 0.4V to 2.4V 0.8V and 2V
Figure 3. AC Testing Input Output Waveform
Figure 4. AC Testing Load Circuit
1.3V
High Speed 3V 1.5V 0V DEVICE UNDER TEST 2.0V 0.8V
AI01822
1N914
3.3k
Standard 2.4V
OUT CL
0.4V
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
AI01823B
Table 6. Capacitance (1) (TA = 25 C, f = 1 MHz )
Symbol CIN C OUT Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF
Note: 1. Sampled only, not 100% tested.
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M27C801
Table 7. Read Mode DC Characteristics (1) (TA = 0 to 70 C or -40 to 85 C; VCC = 5V 10%)
Symbol ILI ILO ICC ICC1 ICC2 IPP VIL VIH
(2)
Parameter Input Leakage Current Output Leakage Current Supply Current Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL Output High Voltage CMOS
Test Condition 0V VIN VCC 0V VOUT VCC E = VIL, GVPP = VIL, IOUT = 0mA, f = 5MHz E = VIH E > VCC - 0.2V VPP = VCC
Min
Max 10 10 35 1 100 10
Unit A A mA mA A A V V V V V
-0.3 2 IOL = 2.1mA IOH = -1mA IOH = -100A 3.6 VCC -0.7V
0.8 VCC + 1 0.4
VOL VOH
Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Maximum DC voltage on Output is VCC +0.5V.
Table 8A. Read Mode AC Characteristics (1) (TA = 0 to 70 C or -40 to 85 C; VCC = 5V 10%)
M27C801 Symbol Alt Parameter Test Condition -45 Min tAVQV tELQV tGLQV tEHQZ (2) tGHQZ (2) tAXQX tACC tCE tOE tDF tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition E = VIL, GVPP = VIL GVPP = VIL E = VIL GVPP = VIL E = VIL E = VIL, GVPP = VIL 0 0 0
(3)
-60 Min Max 60 60 30 0 0 0 25 25 0 0 0 Min
-70 Max 70 70 35 30 30
Unit
Max 45 45 25 25 25
ns ns ns ns ns ns
Notes. 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested. 3. Speed obtained with High Speed AC measurement conditions.
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M27C801
Table 8B. Read Mode AC Characteristics (1) (TA = 0 to 70 C or -40 to 85 C; VCC = 5V 10%)
M27C801 Symbol Alt Parameter Test Condition Min tAVQV tELQV tGLQV tEHQZ (2) tGHQZ (2) tAXQX tACC tCE tOE tDF tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition E = VIL, GVPP = VIL GVPP = VIL E = VIL GVPP = VIL E = VIL E = VIL, GVPP = VIL 0 0 0 -80 Max 80 80 40 35 35 0 0 0 -100/-120/-150 Min Max 100 100 50 40 40 ns ns ns ns ns ns Unit
Notes. 1. VCC must be applied simultaneously with or before V PP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested.
Figure 5. Read Mode AC Waveforms
A0-A19
VALID tAVQV tAXQX
VALID
E tGLQV G tELQV Q0-Q7 tGHQZ Hi-Z tEHQZ
AI01583B
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M27C801
Table 9. Programming Mode DC Characteristics (1) (TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V)
Symbol ILI ICC IPP VIL VIH VOL VOH VID Parameter Input Leakage Current Supply Current Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL A9 Voltage IOL = 2.1mA IOH = -1mA 3.6 11.5 12.5 E = VIL -0.3 2 Test Condition VIL VIN VIH Min Max 10 50 50 0.8 VCC + 0.5 0.4 Unit A mA mA V V V V V
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
Table 10. MARGIN MODE AC Characteristics (1) (TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V)
Symbol tA9HVPH tVPHEL tA10HEH tA10LEH tEXA10X tEXVPX tVPXA9X Alt tAS9 tVPS tAS10 tAS10 tAH10 tVPH tAH9 Parameter VA9 High to VPP High VPP High to Chip Enable Low VA10 High to Chip Enable High (Set) VA10 Low to Chip Enable High (Reset) Chip Enable Transition to VA10 Transition Chip Enable Transition to VPP Transition VPP Transition to VA9 Transition Test Condition Min 2 2 1 1 1 2 2 Max Unit s s s s s s s
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
Table 11. Programming Mode AC Characteristics (1) (TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V)
Symbol tAVEL tQVEL tVCHEL tVPHEL tVPLVPH tELEH tEHQX tEHVPX tVPLEL tELQV tEHQZ
(2)
Alt tAS tDS tVCS tOES tPRT tPW tDH tOEH tVR tDV tDFP tAH
Parameter Address Valid to Chip Enable Low Input Valid to Chip Enable Low VCC High to Chip Enable Low VPP High to Chip Enable Low VPP Rise Time Chip Enable Program Pulse Width (Initial) Chip Enable High to Input Transition Chip Enable High to VPP Transition VPP Low to Chip Enable Low Chip Enable Low to Output Valid Chip Enable High to Output Hi-Z Chip Enable High to Address Transition
Test Condition
Min 2 2 2 2 50 45 2 2 2
Max
Unit s s s s ns
55
s s s s s ns ns
1 0 0 130
tEHAX
Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested.
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M27C801
Figure 6. MARGIN MODE AC Waveforms
VCC
A8
A9 tA9HVPH GV PP tVPHEL E tA10HEH A10 Set tEXA10X tEXVPX tVPXA9X
A10 Reset tA10LEH
AI00736B
Note: A8 High level = 5V; A9 High level = 12V.
Figure 7. Programming and Verify Modes AC Waveforms
A0-A19 tAVEL Q0-Q7 tQVEL VCC tVCHEL GVPP tVPHEL E DATA IN
VALID tEHAX DATA OUT tEHQX tEHQZ
tEHVPX
tELQV
tVPLEL
tELEH
PROGRAM
VERIFY
AI01270
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M27C801
Figure 8. Programming Flowchart Programming When delivered (and after each erasure for UV EPROM), all bits of the M27C801 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0' will be programmed, both '1' and '0' can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C801 is in the programming mode when VPP input is at 12.75V and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V 0.25V. PRESTO IIB Programming Algorithm PRESTO IIB Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. This can be achieved with STMicroelectronics M27C801 due to several design innovations to improve programming efficiency and to provide adequate margin for reliability. Before starting the programming the internal MARGIN MODE circuit is set in order to guarantee that each cell is programmed with enough margin. Then a sequenceof 50s program pulses are applied to each byte until a correct verify occurs. No overprogram pulses are applied since the verify in MARGIN MODE provides the necessary margin. Program Inhibit Programming of multiple M27C801s in parallelwith different data is also easily accomplished. Except for E, all like inputs including GVPP of the parallel M27C801 may be common. A TTL low level pulse appliedto a M27C801'sE input,with VPP at 12.75V, will program that M27C801. A high level E input inhibits the other M27C801s from being programmed. Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL. Data should be verified with t ELQV after the falling edge of E. On-Board Programming The M27C801 can be directly programmed in the application circuit. See the relevant Application Note AN620.
VCC = 6.25V, VPP = 12.75V SET MARGIN MODE
n=0
E = 50s Pulse NO ++n = 25 YES NO VERIFY YES Last Addr NO ++ Addr
FAIL
YES RESET MARGIN MODE CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4.2V
AI01271B
DEVICE OPERATION (cont'd) The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1F ceramic capacitor be used on every device between VCC and VSS. This should be a high frequencycapacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7F bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point.The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
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M27C801
Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its correspondingprogramming algorithm. The ES mode is functional in the 25C 5C ambient temperature range that is required when programming the M27C801. To activate the ES mode, the programming equipmentmust force 11.5Vto 12.5V on address line A9 of the M27C801. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0=VIL) represents the manufacturer code and byte 1 (A0=VIH) the device identifier code. For the STMicroelectronics M27C801, these two identifier bytes are given in Table 4 and can be read-out on outputs Q0 to Q7. ERASURE OPERATION (applies to UV EPROM) Theerasure characteristics of the M27C801is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 A. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 A range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C801 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C801 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C801window to prevent unintentional erasure. The recommended erasure procedure for the M27C801 is exposure to short wave ultraviolet light which has wavelength 2537 A. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm2. Theerasure time with this dosage is approximately 30 to 40 minutes using an ultraviolet lamp with 12000 W/cm2 power rating. The M27C801 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.
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M27C801
ORDERING INFORMATION SCHEME Example: M27C801 -45 K 1 TR
Speed -45 (1) -60 -70 -80 -100 -120 -150 45 ns 60 ns 70 ns 80 ns 100 ns 120 ns 150 ns F B K N
Package FDIP32W PDIP32 PLCC32 TSOP32 8 x 20mm
Temperature Range 1 6 0 to 70 C -40 to 85 C TR X
Option Additional Burn-in Tape & Reel Packing
Note: 1. High Speed, see AC Characteristics section for further information.
For a list of available options (Speed, Package, Temperature Range, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
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M27C801
FDIP32W - 32 pin Ceramic Frit-seal DIP, with window
Symb Typ A A1 A2 A3 B B1 C D D2 E E1 e eA eB L S K K1 N 6.60 10.67 2.54 14.99 38.10 15.24 1.45 0.51 3.91 3.89 0.41 - 0.23 41.73 - - 13.06 - - 16.18 3.18 1.52 - - 4 32 2.49 - - 11 0.260 0.420 mm Min Max 5.72 1.40 4.57 4.50 0.56 - 0.30 42.04 - - 13.36 - - 18.03 0.100 0.590 1.500 0.600 0.057 0.020 0.154 0.153 0.016 - 0.009 1.643 - - 0.514 - - 0.637 0.125 0.060 - - 4 32 0.098 - - 11 Typ inches Min Max 0.225 0.055 0.180 0.177 0.022 - 0.012 1.655 - - 0.526 - - 0.710
A2
A3 A1 B1 B D2 D S
N
A L eA eB C
e1
K
1
E1
E
K1
FDIPW-b
Drawing is not to scale.
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M27C801
PDIP32 - 32 pin Plastic Dual In Line, 600 mils width
Symb Typ A A1 A2 B B1 C D D2 E E1 e1 eA eB L S N 2.54 15.24 38.10 15.24 1.52 mm Min - 0.38 3.56 0.38 - 0.20 41.78 - - 13.59 - - 15.24 3.18 1.78 0 32 Max 5.08 - 4.06 0.51 - 0.30 42.04 - - 13.84 - - 17.78 3.43 2.03 10 0.100 0.600 1.500 0.600 0.060 Typ inches Min - 0.015 0.140 0.015 - 0.008 1.645 - - 0.535 - - 0.600 0.125 0.070 0 32 Max 0.200 - 0.160 0.020 - 0.012 1.655 - - 0.545 - - 0.700 0.135 0.080 10
A2 A1 B1 B D2 D S
N
A L eA eB C
e1
E1
1
E
PDIP
Drawing is not to scale.
13/16
M27C801
PLCC32 - 32 lead Plastic Leaded Chip Carrier, rectangular
Symb Typ A A1 A2 B B1 D D1 D2 E E1 E2 e F R N Nd Ne CP 0.89 1.27 mm Min 2.54 1.52 - 0.33 0.66 12.32 11.35 9.91 14.86 13.89 12.45 - 0.00 - 32 7 9 0.10 Max 3.56 2.41 0.38 0.53 0.81 12.57 11.56 10.92 15.11 14.10 13.46 - 0.25 - 0.035 0.050 Typ inches Min 0.100 0.060 - 0.013 0.026 0.485 0.447 0.390 0.585 0.547 0.490 - 0.000 - 32 7 9 0.004 Max 0.140 0.095 0.015 0.021 0.032 0.495 0.455 0.430 0.595 0.555 0.530 - 0.010 -
D D1
1N
A1 A2
B1
Ne
E1 E
F 0.51 (.020)
D2/E2 B
e
1.14 (.045)
Nd
A R CP
PLCC
Drawing is not to scale.
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M27C801
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20mm
Symb Typ A A1 A2 B C D D1 E e L N CP 0.50 0.05 0.95 0.15 0.10 19.80 18.30 7.90 0.50 0 32 0.10 mm Min Max 1.20 0.15 1.05 0.27 0.21 20.20 18.50 8.10 0.70 5 0.020 0.002 0.037 0.006 0.004 0.780 0.720 0.311 0.020 0 32 0.004 Typ inches Min Max 0.047 0.007 0.041 0.011 0.008 0.795 0.728 0.319 0.028 5
A2
1 N
e E B
N/2
D1 D
A CP
DIE
C
TSOP-a
Drawing is not to scale.
A1
L
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M27C801
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Spec ifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. (c) 1998 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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